Product Overview
High-precision semiconductor packaging tensile tester, JEDEC compliant, for chip bond strength testing and wafer-level reliability evaluation.
Technical Specifications
| Parameter 1 | Load Range 0-500N |
| Parameter 2 | Accuracy ±0.5% |
| Parameter 3 | Speed 0.01-500mm/min |
| Parameter 4 | JEDEC/IEC Compliant |
Features
Automatic test cycle
Data logging & reporting
Multiple fixture options
JEDEC/IEC compliance
High-precision sensors
Touch screen interface
Product Gallery
Applications
Chip Bond Strength Testing
Wafer-Level Reliability Evaluation
Packaging Quality Inspection
Material Mechanical Testing
Quality Control Labs
R&D Testing